641, rue Helene Boucher
78532 Buc, France
Phone: +33 1 30832650
Fax: +33 1 39562589
aminez@3d-plus.com
3D Plus Company Figures
Number of employees: 50-99
Sales volume: 1-9 Mio US $
Export content: > 75%
Year of foundation: 1996
Area of business:
■Electronical Equipment / Medical Technology
3D Plus Company Profile
About 3D Plus
The technique of interconnection in 3 dimensions of all types of components was set up at Thomson-CSF as of 1989.
Comparing to other existing 2-D traditional solutions, this technology allows gaining a factor of at least 10 on the weight and volume of the components.
In 1996, Pierre Maurice and Christian Val, who designed this technology, bought the 3D technology patents and launched 3Dplus Company in order to manufacture cubes based on this principle and patented portfolio.
3Dplus is the only one in Europe to specialise in this technology.
Sustained R&D activities and Innovations allow to extend and patent the 3-D technology capability domain and product range.
The latest technology was developed by 3Dplus in the field of 3-D opto electronics and on 3-D silicon wafer stacking.
In 2001, 3Dplus set up a subsidiary in Mc Kinney, Texas, USA.
In 2002, 3Dplus built a new manufacturing plant in Buc, France for medium series manufacturing.
The company is now 7 years old and its growth rate is 100% per year.
3D Plus Product Categories
Endoscopes and accessories
Video endoscopes, CCD cameras
3D Plus Product Information of Product Category
Camera Heads sensors 28.08.2009 The 3D-microcamera is highly miniaturized, of light weight, high performance and an easy-to-use color CCD Camera suitable for embedded systems and endoscopes applications.
It embeds state-of-the art CCD sensors with high resolution and sensitivity, low smear and dark current, and excellent anti blooming characteristics.
The embedded electronics grant the µcamera with a long cable driving capability : up to 10 meters of cable can be connected between the camera head and the base station (20 meters cable can be connected on specific demand).
The µcamera is packaged through 3D PLUS patented technology qualified for harsh environment applications (vibrations, mechanical shocks, thermal, humidity).
A DSP controlled Electronics Board can be connected to the camera head and is providing the user with all the µcamera settings and control functions like color, brightness, contrast, image window set-up, …
The Camera and the Electronics Board can be delivered as a full OEM video system.
3D Plus Company Contacts
Department/ Name Contact / e-Mail
Chantal LEBLANC cleblanc@3d-plus.com